Linear LED module

ABSTRACT

Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/926,411, filed Jul. 10, 2020, entitled “LINEAR LED MODULE”, which isa continuation of U.S. application Ser. No. 16/208,146, filed Dec. 3,2018, now U.S. Pat. No. 10,711,957; which is a continuation of U.S.application Ser. No. 15/846,076, filed Dec. 18, 2017, now U.S. Pat. No.10,145,522; which is a continuation of U.S. application Ser. No.15/063,263, filed Mar. 7, 2016, now U.S. Pat. No. 9,845,926; which is acontinuation of U.S. application Ser. No.: 14/450,111, filed Aug. 1,2014, now U.S. Pat. No. 9,310,045, the disclosures of which are herebyincorporated by reference in their entireties as if fully set forthherein.

BACKGROUND Field

The present disclosure relates generally to a linear LED module and,more particularly, to a linear LED module that uses a flexible substratewith angled portions.

Background

Solid state light emitting devices, such as light emitting diodes(LEDs), are attractive candidates for replacing conventional lightsources such as incandescent, halogen, and fluorescent lamps. LEDs havesubstantially longer lifetimes than all three of these types ofconventional light sources. In addition, some types of LEDs now havehigher conversion efficiencies than fluorescent light sources and stillhigher conversion efficiencies have been demonstrated in laboratories.Finally, LEDs contain no mercury or other potentially dangerousmaterials, therefore, providing various safety and environmentalbenefits.

A troffer is a light fixture resembling an inverted trough that iseither recessed in, or suspended from, the ceiling. Troffers aretypically designed to emit light using fluorescent lighting tubes. Thefluorescent tubes emit light along the entire length of the troffer toproduce a focused light distribution pattern. However, fluorescentlighting tubes may be expensive, require a warm up period, and produceflicker that is undesirable.

More recently, solid state light emitting devices have been used toreplace fluorescent lamps conventionally used in troffer assemblies.LEDs are attractive candidates for replacing fluorescent lighting tubesbecause LEDs have no warm up time, are long lasting and power efficient,and do not flicker. Troffer assemblies with LED light sources aresometimes referred to as linear LED modules, and conventional linear LEDmodules have been widely utilized in the global troffer market.

Typically, conventional linear LED designs utilize rigid FR4 or MetalCore Printed Circuit Board (MCPCB) substrates coated with a white soldermask for light reflection and diffusion. Such boards are commonlymounted on rigid metal plates (such as aluminum) with reflective sidesfor directing light down into a diffuser lens and out of the metaltroffer tube. The metal plate sometimes also doubles as a heat sink.

The conventional linear LED assembly can be expensive, heavy, and overlycomplex. It is therefore difficult to design a linear LED assembly thatis both cost efficient, lightweight, and is not overly complex.

SUMMARY

Several aspects of the present invention will be described more fullyhereinafter with reference to various apparatuses.

One aspect of a light emitting apparatus includes a substrate having atleast one angled portion. The light emitting apparatus includes at leastone light emitting device arranged on the substrate. The light emittingapparatus includes a plurality of conductors arranged on the substrate.The conductors are electrically coupled to the at least one lightemitting device.

Another aspect of the light emitting apparatus includes at least onelight emitting device. The light emitting apparatus includes a flexiblesubstrate having a member supporting the at least one light emittingdevice. The light emitting apparatus includes an angled portionextending from the member.

An aspect of a lamp includes a housing. The lamp includes a lightemitting apparatus coupled to the housing. The light emitting apparatusincludes at least one light emitting device. The light emittingapparatus includes a flexible substrate carried by the housing. Theflexible substrate includes a reflective portion and a diffusiveportion, wherein the at least one light emitting device is arranged onthe diffusive portion.

BRIEF DESCRIPTION OF THE DRAWINGS

The various aspects of the present invention illustrated in the drawingsmay not be drawn to scale. Rather, the dimensions of the variousfeatures may be expanded or reduced for clarity. In addition, some ofthe drawings may be simplified for clarity. Thus, the drawings may notdepict all of the components of a given apparatus or method.

Various aspects of the present invention will be described herein withreference to drawings that are schematic illustrations of idealizedconfigurations of the present invention. As such, variations from theshapes of the illustrations as a result, for example, manufacturingtechniques and/or tolerances, are to be expected. Thus, the variousaspects of the present invention presented throughout this disclosureshould not be construed as limited to the particular shapes of elements(e.g., regions, layers, sections, substrates, bulb shapes, etc.)illustrated and described herein but are to include deviations in shapesthat result, for example, from manufacturing. By way of example, anelement illustrated or described as a rectangle may have rounded orcurved features and/or a gradient concentration at its edges rather thana discrete change from one element to another. Thus, the elementsillustrated in the drawings are schematic in nature and their shapes arenot intended to illustrate the precise shape of an element and are notintended to limit the scope of the present invention.

Various aspects of apparatuses will now be presented in the detaileddescription by way of example, and not by way of limitation, withreference to the accompanying drawings, wherein:

FIG. 1 illustrates an exemplary embodiment of an LED

FIG. 2 illustrates an exemplary embodiment of an LED chip having aflip-chip architecture.

FIG. 3a illustrates a plan view of an exemplary embodiment of a lightemitting apparatus having several LEDs arranged on a flexible substrate.

FIG. 3b illustrates a cross-section view of an exemplary embodiment of alight emitting apparatus having an encapsulated LED arranged on aflexible substrate.

FIG. 4a illustrates a top view of an exemplary embodiment of a lightemitting apparatus having several LEDs arranged on a flexible substrate.

FIG. 4b illustrates a cross-section view of an exemplary embodiment of alight emitting apparatus having the flexible substrate of FIG. 4 a.

FIG. 5 illustrates a cross-section view of a troffer device of anexemplary embodiment of the light emitting device having a flexiblesubstrate.

FIG. 6 illustrates a side view of a troffer device of an exemplaryembodiment of the light emitting device.

FIG. 7 illustrates a cross-section view of a troffer device thatprovides light distribution pattern.

DETAILED DESCRIPTION

The detailed description set forth below in connection with the appendeddrawings is intended as a description of various exemplary embodimentsof the present invention and is not intended to represent the onlyembodiments in which the present invention may be practiced. Thedetailed description includes specific details for the purpose ofproviding a thorough understanding of the present invention. However, itwill be apparent to those skilled in the art that the present inventionmay be practiced without these specific details. In some instances,well-known structures and components are shown in block diagram form inorder to avoid obscuring the concepts of the present invention. Acronymsand other descriptive terminology may be used merely for convenience andclarity and are not intended to limit the scope of the invention.

The word “exemplary” is used herein to mean serving as an example,instance, or illustration. Any embodiment described herein as“exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments. Likewise, the term “embodiment” ofan apparatus, method or article of manufacture does not require that allembodiments of the invention include the described components,structure, features, functionality, processes, advantages, benefits, ormodes of operation.

The various aspects of the present invention illustrated in the drawingsmay not be drawn to scale. Rather, the dimensions of the variousfeatures may be expanded or reduced for clarity. In addition, some ofthe drawings may be simplified for clarity. Thus, the drawings may notdepict all of the components of a given apparatus or method. Variousaspects of the present invention will be described herein with referenceto drawings that are schematic illustrations of idealized configurationsof the present invention. As such, variations from the shapes of theillustrations as a result, for example, manufacturing techniques and/ortolerances, are to be expected. Thus, the various aspects of the presentinvention presented throughout this disclosure should not be construedas limited to the particular shapes of elements (e.g., regions, layers,sections, substrates, etc.) illustrated and described herein but are toinclude deviations in shapes that result, for example, frommanufacturing. By way of example, an element illustrated or described asa rectangle may have rounded or curved features and/or a gradientconcentration at its edges rather than a discrete change from oneelement to another. Thus, the elements illustrated in the drawings areschematic in nature and their shapes are not intended to illustrate theprecise shape of an element and are not intended to limit the scope ofthe present invention.

It will be understood that when an element such as a region, layer,section, substrate, or the like, is referred to as being “on” anotherelement, it can be directly on the other element or intervening elementsmay also be present. In contrast, when an element is referred to asbeing “directly on” another element, there are no intervening elementspresent. It will be further understood that when an element is referredto as being “formed” on another element, it can be grown, deposited,etched, attached, connected, coupled, or otherwise prepared orfabricated on the other element or an intervening element.

Furthermore, relative terms, such as “beneath” or “bottom” and “above”or “top,” may be used herein to describe one element's relationship toanother element as illustrated in the drawings. It will be understoodthat relative terms are intended to encompass different orientations ofan apparatus in addition to the orientation depicted in the drawings. Byway of example, if an apparatus in the drawings is turned over, elementsdescribed as being “above” other elements would then be oriented “below”other elements and vice versa. The term “above”, can therefore,encompass both an orientation of “above” and “below,” depending of theparticular orientation of the apparatus. Similarly, if an apparatus inthe drawing is turned over, elements described as “below” other elementswould then be oriented “above” the other elements. The terms “below”can, therefore, encompass both an orientation of above and below.

It will be further understood that the terms “comprises” and/or“comprising,” when used in this specification, specify the presence ofstated features, steps, operations, elements, and/or components, but donot preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The term “and/or” includes any and all combinations of one ormore of the associated listed items.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by aperson having ordinary skill in the art to which this invention belongs.It will be further understood that terms, such as those defined incommonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand the present disclosure and will not be interpreted in an idealizedor overly formal sense unless expressly so defined herein.

In the following detailed description, various aspects of the presentinvention will be presented in the context of a light-emitting device. Alight-emitting die shall be construed broadly to include any suitablesolid state light source such as, by way of example, a light emittingdiode (LED) or other solid state material which releases photons orlight through the recombination of electrons and holes flowing across ap-n junction. Accordingly, any reference to an LED or light throughoutthis disclosure is intended only to illustrate the various aspects ofthe present invention, with the understanding that such aspects may havea wide range of applications.

The following description describes a linear LED module that is designedto minimize cost while providing the same efficacy as conventionallinear LED modules. The linear LED module utilizes a flexible substrate,which will be described in greater detail below. The flexible substrateminimizes the complexity associated with designing linear LED modulesfor troffer devices by providing bendable portions which can be adjustedto fit most designs. Moreover, the flexible substrate negates the needfor a rigid substrate coupled to a heavy reflector. The flexiblesubstrate is capable of providing the same directed light effect of boththe rigid substrate and attached reflector, but at a lower cost. As willbe discussed in greater detail below, several LEDs having differentdesigns may be arranged on the flexible substrate. FIG. 1 is an exampleof one such LED design.

FIG. 1 illustrates an exemplary embodiment of an LED 101. An LED is asemiconductor material impregnated, or doped, with impurities. Theseimpurities add “electrons” or “holes” to the semiconductor, which canmove in the material relatively freely. Depending on the kind ofimpurity, a doped region of the semiconductor can have predominantlyelectrons or holes, and is referred respectively as n-type or p-typesemiconductor regions.

Referring to FIG. 1, the LED 101 includes an n-type semiconductor region114 and a p-type semiconductor region 118. A reverse electric field iscreated at the junction between the two regions, which cause theelectrons and holes to move away from the junction to form an activeregion 116. When a forward voltage sufficient to overcome the reverseelectric field is applied across the p-n junction through a pair ofelectrodes 108, 106, electrons and holes are forced into the activeregion 116 and recombine. When electrons recombine with holes, they fallto lower energy levels and release energy in the form of light.

In this example, the n-type semiconductor region 114 is formed on asubstrate 102 and the p-type semiconductor region 118 is formed on theactive layer 116, however, the regions may be reversed. That is, thep-type semiconductor region 118 may be formed on the substrate 102 andthe n-type semiconductor region 114 may formed on the active layer 116.As those skilled in the art will readily appreciate, the variousconcepts described throughout this disclosure may be extended to anysuitable layered structure. Additional layers or regions (not shown) mayalso be included in the LED 101, including but not limited to buffer,nucleation, contact and current spreading layers or regions, as well aslight extraction layers.

The p-type semiconductor region 118 is exposed at the top surface, andtherefore, the p-type electrode 106 may be readily formed thereon.However, the n-type semiconductor region 114 is buried beneath thep-type semiconductor layer 118 and the active layer 116. Accordingly, toform the n-type electrode 108 on the n-type semiconductor region 114, acutout area or “mesa” is formed by removing a portion of the activelayer 116 and the p-type semiconductor region 118 by means well known inthe art to expose the n-type semiconductor layer 114 there beneath.After this portion is removed, the n-type electrode 108 may be formed.

FIG. 2 illustrates an exemplary embodiment of an LED chip having aflip-chip architecture. Flip-chip LED 201 includes similar features ofthe LED illustrated in FIG. 1. However, the features are flipped over.For instance, electrodes 106 and 108 are positioned beneath p-typesemiconductor region 118 and n-type semiconductor region 114 rather thanabove the p-type semiconductor region 118 and n-type semiconductorregion 114 as shown in FIG. 1. As a result solders 225 couple theflip-chip LED 201 to conductive layer 230. The conductive layer isarranged over substrate 235. As will be discussed in greater detail inthe following sections, the substrate 235 may be a flexible substratecapable of being bent into different configurations.

FIG. 3a illustrates a plan view of an exemplary embodiment of a lightemitting apparatus 300 having several LEDs 350 arranged on a flexiblesubstrate 340. An example of a flexible substrate 340 is an Al substratehaving a thickness between 0.1 mm and 0.5 mm. Alternatively, thesubstrate 340 may be a multi-layer structure having a similar thicknessbetween 0.1 mm and 0.5 mm. The multi-layer structure may be formed withtwo Al layers separated by a dielectric layer, Al and Cu layersseparated by a dielectric layer, two Cu layers separated by a dielectriclayer, or some other suitable layered structure. Those skilled in theart will be readily able to determine the appropriate material andthickness of the material to produce a flexible substrate suitable forany particular application.

The plan view includes LEDs 350, flexible substrate 340 and a topsurface of the flexible substrate 310. The LEDs 350, in some aspects ofthe apparatus, may be lateral LEDs such as the LED architecturedescribed with respect to FIG. 1 or flip-chip LEDs such as the LEDarchitecture described with respect to FIG. 2. The flexible substrate340 of some aspects of the apparatus may be manufactured using areel-to-reel process. The reel-to-reel process involves creating anelectronic device (or substrate) on a roll of flexible plastic or metalfoil. LEDs are then mounted to the substrate. In the example shown inFIG. 3a , the substrate 340 may be an aluminum substrate manufacturedusing the reel-to-reel process.

As will be shown in greater detail in the following drawings, the LED350 may be a chip on board package that is mounted directly to thesubstrate 340. In addition, the LEDs 350 may be lateral LEDs orflip-chip LEDs. The substrate 340 may also include conductors 310 tointerconnect the LEDs 350. An insulation layer (not shown) may be formedbetween the substrate 334 and the conductors 310 to electricallyinsulate the two.

In one embodiment, the top surface of the substrate 340 may include areflective layer (not shown). An insulation layer (not shown) may beformed between the reflective layer and the conductors 310 with vias toprovide electrical connections between the conductors 310 and the LEDs350. In an alternative embodiment, the reflective layer may be aninsulator, thereby eliminating the need for a separate insulation layerbetween the reflective layer and the conductors 310. By way of example,the reflective layer may be a white solder mask such as thosemanufactured by Taiyo America or other manufacturers.

The substrate 340 provides a thinner lightweight substrate for linearLEDs, which is more customizable and cost efficient. The substrate 340replaces the need for a heavy reflector and rigid substrate combination.Thus, the flexible substrate provides a less complex design thatproduces the same directed lighting effect.

FIG. 3b illustrates a cross-section view of an exemplary embodiment of alight emitting apparatus 300 having an encapsulated LED arranged on aflexible substrate. In some aspects of the apparatus, FIG. 3b is across-sectional view of the light emitting apparatus illustrated in FIG.3a . Similar to FIG. 3a , the cross-sectional view includes the LED 350,the flexible substrate 340, and the top surface of the flexiblesubstrate 310. The cross-sectional view additionally includes bendingpoints 370. The LED 350 includes a flip-chip LED 330 and an encapsulant320, forming a chip-on-board package. In some aspects of the apparatus,a phosphor may also be disposed over LED 330 and the encapsulant may bea lens. Although this exemplary view includes a flip-chip LED 330, anysuitable LED design could be mounted on the substrate 340. Furthermore,the design illustrated in FIGS. 3a and 3b is not only limited tochip-on-board packages.

The flexible substrate 340 is configured to bend at bending points 370.The ability to bend the flexible substrate 340 at the bending points 370replaces the need for a reflector in addition to the rigid substrateused in conventional linear LED modules. Additionally, the angle of thebend can be customized, making the same flexible substrate 340 capableof accommodating different troffer designs. By bending the flexiblesubstrate 340, the light emitting apparatus may be capable of focusinglight in a downward direction to a diffusive lens, which is typicallyused in troffer assemblies.

FIG. 4a illustrates a top view of an exemplary embodiment of a lightemitting apparatus 400 having several LEDs arranged on a flexiblesubstrate. FIG. 4a includes similar features to those already discussedwith respect to FIGS. 3a and 3b . However, FIG. 4a differs from FIGS. 3aand 3b in that it includes angled portions 360 that have been bent up atbending points 370.

As discussed above portions of the substrate 340 may include reflectivesurfaces. In this example, angled portions 360 may include thereflective portions of the substrate. The top portion 410 of thesubstrate that is between the bending points 370 may include thediffusive layer. However, as discussed above, the angled portions 360and horizontal surface 410 may have a diffusive material layered abovethe surface such as a white solder mask. In some aspects of theapparatus, the diffusive material may be printed around the LEDs 350 onthe horizontal surface 410. The angled portions 360 may have areflective material layered above the diffusive material. Conversely,the angled portions 360 may have exposed aluminum. Thus, the reflectivesurfaces of the flexible substrate provide the same effect as the rigidmetal reflector plate used in conventional linear LED modules.Additionally, a conductive layer may be arranged over the surface 410depending on the type of LED utilized for the design.

FIG. 4b illustrates a cross-section view of an exemplary embodiment of alight emitting apparatus having the flexible substrate of FIG. 4a . Asillustrated in more detail, the bent portions 360 of the flexiblesubstrate are bent up at bending points 470. The angled portions 360 arebent at a particular angle 480. The particular angle 480 may be apredetermined angle based on specifications of a lighting module thatwill use the flexible substrate. Preferably, the angle 480 may bebetween 30° and 60°, bit other angle may be used depending on theparticular application. Thus, the exemplary design illustrated in FIG.4b provides the same effect as conventional linear LED modules, but usesa less costly and less complex design.

In some aspects of the apparatus, the flexible substrate 340 may bemounted on an inexpensive linear plastic object. Additionally, the anglemay be adjusted to suit different troffer designs, while still providingthe requisite focusing effect on the emitted light.

FIG. 5 illustrates a cross-section view of a troffer device 500 of anexemplary embodiment of the light emitting device having a flexiblesubstrate. The illustrated troffer device 500 may be suitable for use anas internal lighting device, such as a ceiling light. The troffer device500 includes a housing 530. In some aspects of the light emittingdevice, the housing 540 may be a housing that is typically used forfluorescent lighting. The housing 540 includes a flexible substrate 510and several LEDs 520. As shown, the LEDs 520 are arranged on theflexible substrate 510. The flexible substrate and light distributionpattern emitted from the troffer device 500 will be discussed in greaterdetail with respect to FIGS. 6 and 7.

FIG. 6 illustrates a side view of a troffer device 600 of an exemplaryembodiment of the light emitting device. The side view illustrated inFIG. 6 may be a side view of the troffer device 500 described withrespect to FIG. 5. As shown, the troffer device 600 includes a housing630, a reflective surface 610 of the flexible substrate, a diffusivesurface 650 of the flexible substrate, and a bending point 660. FIG. 6also illustrates a light distribution pattern 640.

As shown, the LED 620 is arranged on the diffusive surface 650. In someaspects of the light emitting device, the diffusive surface 650 covers aportion of the flexible substrate around the LED 620 and between angledportions of the flexible substrate. The angled portion of the flexiblesubstrate may include the reflective surface 610. As shown, the flexiblesubstrate is bent at bending point 660 to fit the housing 630. Theflexible substrate may be bent along any point to form various differentangles and configurations. Thus, the flexible substrate may beconfigured to fit a variety of different sized troffer housings.

The troffer device 600 is configured to focus light in a downwarddirection as is shown by light distribution pattern 640. Specifically,the reflective portions 610 of the flexible substrate are angled suchthat light emitted from the LED 620 may reflect off of the reflectivesurface 610 to enhance the light distribution effects of the trofferdevice 600 by focusing the light downward. The light may be focusedtoward a diffusive lens positioned at the bottom of the troffer device,which produces a more uniform light distribution. Additionally, some ofthe light emitted from LED 620 may be diffused by the diffusive surface650 further enhancing the lighting efficacy. The combination of thediffusive surface 650 and reflective surfaces 610 of the flexiblesubstrate provides a downward focused light distribution pattern 640similar to the light distribution pattern of conventional linear LEDmodules that use a substrate mounted on a reflector.

FIG. 7 further illustrates a cross-section view of a troffer device 700that provides light distribution pattern 750. FIG. 7 illustrates similarcomponents to those described with respect to FIGS. 5 and 6. Forinstance, troffer device 700 includes a housing 670 similar to housing530. The housing includes a flexible substrate 710 similar to theflexible substrate 510. The flexible substrate 510 includes a diffusiveportion 720, which is similar to the diffusive portion 650.Additionally, the housing includes several LEDs 730, similar to the LED620, arranged on the diffusive portion of the flexible substrate.

As shown, LEDs 730 may emit light 740, which is reflective off of theangled portions of the flexible substrate as described with respect toFIG. 6. Additionally, some of the emitted light 760 may be diffused bythe diffusive portion 720 of the flexible substrate. The combination ofthe diffused and reflected light produces a focused light distributionpattern which may be diffused by a lens to produce the more desirableuniform lighting pattern 750. Thus, the flexible substrate arrangement asuitable replacement for the rigid reflector and substrate ofconventional linear LED lighting systems because it produces the samelighting effect while using a simpler design.

The various aspects of this disclosure are provided to enable one ofordinary skill in the art to practice the present invention. Variousmodifications to exemplary embodiments presented throughout thisdisclosure will be readily apparent to those skilled in the art, and theconcepts disclosed herein may be extended to other devices. Thus, theclaims are not intended to be limited to the various aspects of thisdisclosure, but are to be accorded the full scope consistent with thelanguage of the claims. All structural and functional equivalents to thevarious components of the exemplary embodiments described throughoutthis disclosure that are known or later come to be known to those ofordinary skill in the art are expressly incorporated herein by referenceand are intended to be encompassed by the claims. Moreover, nothingdisclosed herein is intended to be dedicated to the public regardless ofwhether such disclosure is explicitly recited in the claims. No claimelement is to be construed under the provisions of 35 U.S.C. § 112(f)unless the element is expressly recited using the phrase “means for” or,in the case of a method claim, the element is recited using the phrase“step for.”

What is claimed is:
 1. A flip-chip light emitting device comprising: aflexible substrate having a conductive layer disposed thereon; aplurality of semiconductor layers disposed above the conductive layer; apair of electrodes disposed between the flexible substrate and theplurality of semiconductor layers and coupling the plurality ofsemiconductor layers to the conductive layer, respectively; and at leastone side extending from the flexible substrate and having a reflectivesurface that has a greater reflectivity than the flexible substrate. 2.The flip-chip light emitting device according to claim 1, wherein the atleast one side extends from the flexible substrate at an angle between30-60 degrees.
 3. The flip-chip light emitting device according to claim1, further comprising a diffusive surface disposed on the flexiblesubstrate and around the plurality of semiconductor layers.
 4. Theflip-chip light emitting device according to claim 3, wherein thediffusive surface comprises a white portion disposed on the flexiblesubstrate.
 5. The flip-chip light emitting device according to claim 1,wherein the flexible substrate comprises a support member configured tosupport the plurality of semiconductor layers, with the at least oneside extending therefrom.
 6. The flip-chip light emitting deviceaccording to claim 5, wherein an angle between the support member andthe at least one side is configured to accommodate a troffer lightfixture.
 7. The flip-chip light emitting device according to claim 1,further comprising an encapsulant that encapsulates the plurality ofsemiconductor layers.
 8. The flip-chip light emitting device accordingto claim 1, wherein the plurality of semiconductor layers comprises ap-type semiconductor region and n-type semiconductor region with anactive region formed therebetween.
 9. The flip-chip light emittingdevice according to claim 1, wherein the flexible substrate isconstructed to be bent into different configurations.
 10. A trofferdevice comprising: a housing; a flexible substrate coupled to thehousing and having a conductive layer disposed thereon; a plurality ofsemiconductor layers disposed above the conductive layer; a pair ofelectrodes disposed between the flexible substrate and the plurality ofsemiconductor layers and coupling the plurality of semiconductor layersto the conductive layer, respectively; and at least one side extendingfrom the flexible substrate and having a reflective surface that has agreater reflectivity than the flexible substrate.
 11. The troffer deviceaccording to claim 10, wherein the at least one side extends from theflexible substrate at an angle between 30-60 degrees.
 12. The trofferdevice according to claim 10, further comprising a diffusive surfacedisposed on the flexible substrate and around the plurality ofsemiconductor layers.
 13. The troffer device according to claim 12,wherein the diffusive surface comprises a white portion disposed on theflexible substrate.
 14. The troffer device according to claim 10,wherein the flexible substrate comprises a support member configured tosupport the plurality of semiconductor layers, with the at least oneside extending therefrom.
 15. The troffer device according to claim 14,wherein an angle between the support member and the at least one side isconfigured to accommodate a troffer light fixture.
 16. The trofferdevice according to claim 10, further comprising an encapsulant thatencapsulates the plurality of semiconductor layers.
 17. The trofferdevice according to claim 10, wherein the plurality of semiconductorlayers comprises a p-type semiconductor region and n-type semiconductorregion with an active region formed therebetween.
 18. The troffer deviceaccording to claim 10, wherein the flexible substrate is constructed tobe bent into different configurations.
 19. A flip-chip light emittingdevice comprising: a flexible substrate constructed to be bent intodifferent configurations; a conductive layer disposed on the flexiblesubstrate; a plurality of semiconductor layers disposed above theconductive layer; a pair of electrodes coupling the plurality ofsemiconductor layers to the conductive layer, respectively; and at leastone side extending from the flexible substrate and having a reflectivesurface that has a greater reflectivity than the flexible substrate. 20.The flip-chip light emitting device according to claim 19, wherein theat least one side extends from the flexible substrate at an anglebetween 30-60 degrees.